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LC5200 Series LED Drivers
Features and Benefits
Supply voltage, VBB, 450 V maximum, 25 to 400 V recommended; Note: lowest voltage can vary depending on LED loads Output current IO(max) options: 0.5 A, LC5205D 1.0 A, LC5210D Constant current control circuit: Fixed off-time PWM constant current control, off-time adjustable by external components Externally adjustable output current by input voltage to REF pin Output current dimming by external PWM signal; low signal to TOFF pin shuts off output current, and PWM signal input to that pin enables dimming Undervoltage lockout protection (UVLO) Overcurrent protection (OCP); latched in response to the short-to-GND condition Thermal Shutdown protection (TSD); protects IC from damage due to excess temperature, auto-restart when temperature drops below threshold
Description
LC5200 series is an off-line LED driver IC which includes both a main controller integrated circuit (MIC) and a power MOSFET. Its high voltage capability allows direct connection to a wide range of supply voltages ranging from 25 to 400 V (recommended). The LC5200 uses constant current mode to drive LEDs. The package is a standard 8-pin DIP, with pin 7 removed for greater creepage distance from the supply pin.
Package: 7-pin DIP
Not to scale
Functional Block Diagram
VBB MIC Reg Regulator UVLO TSD OUT
Toff Ref
Current Control
Logic OCP
Gate Driver
GND
Sen
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LC5200 Series
Selection Guide
Part Number
LC5205D LC5210D
LED Drivers
Output Current, IO(max) (A)
0.5 1.0
Absolute Maximum Ratings at TA = 25C
Characteristic Supply Voltage Output Breakdown Voltage Output Current REF Pin Input Voltage SENSE Pin Voltage Allowable Power Dissipation Junction Temperature Operating Ambient Temperature Storage Temperature Symbol VBB VO IO VREF VRS PD TJ TA Tstg tw 1 s On Sanken evaluation PCB; affected by application PCB layout LC5205D, tw 1 s LC5210D, tw 1 s Notes Rating 450 450 0.5 1.0 -0.3 to VREG + 0.3 2 1.73 150 -40 to 105 -40 to 150 Units V V A A V V W C C C
Recommended Operating Conditions
Characteristic Supply Voltage Average Output Current REF Input Voltage Case Temperature Symbol VBB IO VREF TC Conditions Lowest voltage can vary depending on LED loads LC5205D LC5210D In normal operation Measured at center of case, TJ < 150C Min. 25 - - - - Typ. - - - - - Max. 400 0.4 0.8 0.5 105 Unit V A A V C
Terminal List Table
Name Number 1 2 3 4 5 6 7 8 Function Regulator output pin for powering external components. Connect 0.1 F bypass capacitor between this pin and GND. For self-oscillation operation, connect external capacitor and resistor to set off-time. For externally-controlled PWM operation, input PWM adjustment signal. Reference voltage input pin, for output peak current. Connect external resistor for PWM peak current control and OCP. Internally connected to the MOSFET drain, output connection to LED load. Supply voltage pin; internally connected to the voltage regulator to power the internal circuits. No connection; pin removed to increase creepage distance from VBB pin. Device ground pin.
Pin-out Diagram
Reg 1 Toff 2 Ref 3 Sen 4 8 GND 7 (Removed) 6 VBB 5 OUT
Reg Toff Ref Sen OUT VBB - GND
All performance characteristics given are typical values for circuit or system baseline design only and are at the nominal operating voltage and an ambient temperature of 25C, unless otherwise stated.
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LC5200 Series
ELECTRICAL CHARACTERISTICS Valid at TA = 25C and VBB = 140 V, unless otherwise noted
Characteristics Supply Voltage Input Current MOSFET Breakdown Voltage MOSFET On-Voltage MOSFET Diode Forward Voltage REG Pin Output Voltage REG Pin Maximum Output Current Maximum PWM Operating Frequency REF Pin Input Voltage REF Pin Input Current SENSE Pin Voltage SENSE Pin Current OCP Threshold Voltage PWM Off-Time UVLO On Threshold Voltage UVLO Off Threshold Voltage TSD Threshold Temperature TSD Hysteresis Temperature Switching Time Symbol IBB IBBS VDSS VDS(on) VF VREG IREG fclk VREF IREF VRS IRS VOCP TPOFF VUVLO(on) VUVLO(off) TTSD TTSDhys tr tf ID = 0.4 A ID = 0.4 A Measured at SENSE pin RTOFF = 560 k, CTOFF = 220 pF For VBB For VBB Main controller IC (MIC) temperature At output off ID = 1 mA ID = 0.5 A, LC5205 ID = 1.0 A, LC5210 ID = 0.5 A, LC5205 ID = 1.0 A, LC5210 IREG = 0 mA VREG = 11.5 V PWM frequency Test Conditions Normal operation Min. - - 450 - - - - 11.5 - - 0 - VREF - 0.03 - - - - - - - - - Typ. 2 0.6 - 3 2.5 0.85 0.9 12 - - - 10 VREF 10 3 21 13 14 150 55 20 50
LED Drivers
Max. - 1 - - - - - 12.5 2 200 1 - VREF + 0.03 - - - - - - - - -
Unit mA mA V V V V V V mA kHz V A V A V s V V C C ns ns
Power Dissipation versus Ambient Temperature
Maximum Allowable Power Dissipation PD (W) 2
PD = 1.73 W
1.5 RJA = 72C/W 1
0.5
0 0 25 50 75 100 125 150
Ambient Temperature, TA (C)
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LC5200 Series
Functional Description
Regulator The LC5200 series provides 12 V output voltage, generated from the supply voltage on the VBB pin, which is used to power internal circuits and external components. When the gate capacitance charging of the MOSFET occurs, it generates a current surge, which results in ripple voltage. This could affect operation, therefore, connect a 0.1 F ceramic capacitor at the REG pin to stabilize operation. Current Control Current control is done by a fixed off-time PWM topology. The output current level can be set by the input voltage on the REF pin, and voltage across the current sense resistor at the SENSE pin. In addition, the fixed off-time can be adjusted by the values selected for the external capacitor and resistor at the TOFF pin. UVLO (Undervoltage Lock Out) This prevents the device from malfunctioning by shutting down the output circuit when the internal supply voltage becomes lower than the ULVO threshold voltage, VUVLO . In addition, the UVLO circuit is used for the power-on reset function of overcurrent protection (OCP). TSD (Thermal Shutdown) When the main control chip (MIC) temperature exceeds the TSD threshold temperature, TTSD , the device shuts off the output (system logic continues to operate), in order to avoid abnormal tem-
LED Drivers
perature increase. When the temperature drops by the hysteresis amount, TTSDhys , or if the supply voltage is recycled, the device returns to normal operation. Note: The primary source of heating is the MOSFET, and there is a delay while the heat spreads to the MIC and is sensed. Therefore, a rapid temperature increase of the MOSFET may damage the device. OCP (Overcurrent Protection) When the SENSE pin input voltage reaches the OCP threshold, VOCP , it shuts off the output and shifts into latch mode. In order to release from latch mode, cycle the device power supply. Note: OCP is for protecting the device from excess current. OCP may not work at an LED-short condition because the coil may suppress current increase. Internal Switching Logic The device turns the MOSFET gate driver circuit on or off based on the status of the current control sensing circuit and the protection circuits. Gate-Driver Operation This comprises the MOSFET gate driver circuit. The two device versions in the LC5200 series are distinguished from each other by the MOSFET current rating. Select the current rating that best matches the application circuit.
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LC5200 Series
Application Information
Typical Application Example A typical application circuit is shown in figure 1. The values of the external components are shown in the adjacent table. Component Value Setting LED LED current should not exceed the LC5200 device current
LED Drivers
ratings. Set the total voltage drop across the LED string to be less than VBB; otherwise, the LED string turns off. As a general design rule, the PWM off-time should be longer if there is a small drop in voltage across the LED string, and it should be shorter if there is a high drop in voltage across the LED string. For the LC5205D, a 9 to 30 V drop across the LED string is recommended for proper operation.
Input
Line Filter
CO Reg ROff R1 Toff Ref COff R2 C1 VBB
Di
LED
LC5200 OUT
GND Sen RS
L
Figure 1. Typical application circuit
Referenced Typical Application Components
Symbol C0 C1 COff Di L LED R1 R2 ROff RS Components Electrolytic capacitor Capacitor Capacitor Diode Coil LEDs Resistor Resistor Resistor Resistor Values / Ratings 100 F / 450 V 0.1 F / 25 V 100 pF / 25 V RL3A 1 mH / 1 A 680 k / 620 k /
1/ 8
Descriptions Main supply source voltage rectifying capacitor Note: 1 F can be used The internal regulator output capacitor PWM off-time adjusting capacitor High voltage, ultrafast rectifying, current recirculation diode PWMing choke coil LED load Reference pin voltage setup resistor Reference pin voltage setup resistor PWM off-time adjusting resistor Output current sensing resistor
W W
20 k / 1/8 W
1/ 8
1.0 / 1 W
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LC5200 Series
L This is the choke coil for constant-current PWM operation. The higher the inductance of this component, the less ripple amplitude the output current has. In general, 0.5 to 20 mH is recommended. Also ensure the coil does not saturate at the peak of the ripple current. Saturation causes high surge current and it could cause damage to the LEDs or the device. Di This diode provides a path for recirculation current. If a diode with slow recovery characteristics is used, it will cause surge current when the MOSFET turns on, as well as noise increase and device malfunction may result. In addition, it causes efficiency drop. Therefore, the Sanken RL3A ultrafast recovery diode, or a diode of better or equal recovery characteristics (50 ns), is recommended. CO This is the main supply voltage rectifying capacitor. The greater the capacitance, the less ripple voltage occurs. In addition, because higher output power causes an increase of the ripple voltage, choose a proper value of capacitance for the output power. Even if the capacitance is low (like 1000 pF) and the ripple voltage becomes high, the device works. It also makes possible a non-electrolytic capacitor design, which results in lengthening unit life and reducing unit size and cost. However, if the bottom of the ripple voltage falls below the LC5200 UVLO threshold, or below the voltage drop of the LED string, the LEDs are turned off during that period. C1 This capacitor is for stabilizing the internal regulator circuit operation. Connect a 0.1 F capacitor as close to the device as possible in order to operate the MOSFET properly. Using a small capacitance value causes slow switching speed and malfunctioning, however, a large value of capacitance causes slow startup.
LED Drivers
R1, R2, RS These determine the LED peak current, according to the following formula: IPEAK = VREG x R2 / ( [ R1 + R2 ] x RS ) For example, if the target is an IPEAK of 0.35 A, the formula becomes: IPEAK 12 (V) x 20 (k) / ([20 (k) + 680 (k) ] x 1 ) = 0.35 A Based on it, R1 = 20 k, R2 = 680 k, and RS = 1 can be determined. Note that R1 and R2 cause power consumption by the internal regulator. Therefore, follow the formula below in order to minimize the power consumption: ( R1 + R2 ) > 500 k In actual design, the current peak tends to be higher than the estimated value, due to internal circuit delays. This becomes obvious at high di/dt conditions, which can result from high VBB or from low coil inductance. With regard to the resistor RS, because output current runs through it, use a resistor rated for 2 to 3 times higher than the power dissipation. ROFF, COFF These decide PWM off-time, TPOFF. Figure 2 shows PWM off-time curves based on various values of Coff and Roff. PWM off-time is approximately 20 s at the recommended values: Roff = 560 k and Coff = 220 pF.
50
0p F CO ff=47 2 0pF COf f=2 pF CO ff=100
COf f=47p F
CO ff=22pF C f f=10pF
O
PWM TOff [s]
20
10
5
2
1 200 400 600 800 1000
ROff[k]
Figure 2. Affect of various values for capacitor COFF and resistor ROFF on PWM off-time
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LC5200 Series
Current Control PWM current control works as shown in figure 3.
Description of Operation
LED Drivers
* PWM On Period. During MOSFET on-time, the current runs through the ION path (shown in red in figure 3, panel A). * MOSFET Turn Off. During on-time, the current increases as the red waveform in panel B, and when it reaches the VSENSE threshold voltage, the MOSFET turns off. * PWM Off Period. During MOSFET off-time, the back EMF occurs on the coil and the energy which is charged on the coil during the on-time is deenergized by the current IOFF running through the path in blue of panel A. * MOSFET Turn On. After the fixed off-time, which is set by the external capacitor and resistor at the Toff pin, the MOSFET turns on again, and repeats the above operations. Figure 4 shows the current control circuit and figure 5 shows the timing diagram of that circuit. When the MOSFET turns on, both the load current and VSen, across the sensing resistor RS, increase. Comp2 compares VSen and VRef and its output is inverted at VSen > VRef (see point A in figure 5). This resets the latter RS latch and it results in turning off the MOSFET after the signal goes through several logic circuits. At the same time, Coff at the Toff pin is discharged by the internal MOS switch, and when the Comp1 inverting input (linked to the Toff pin) voltage becomes lower than 2 V, Comp1 output is inverted and it sets the RS latch. This turns off the MOS switch and initiates the charging process of Coff by Roff. Coff voltage (Toff pin) increases by it and when its voltage reaches 3 V, Comp1 output becomes high and it turns on the MOSFET (point B in figure 5). The Blank Pulse circuit creates periods that mask surge or ringing noise, from turn off edge to just after the turn on edge, for securing proper PWM operation.
ION VBB IOFF Di OUT L SENSE RS GND VSENSE LED
ILED VREF VSENSE toff Ion Ioff Ion Ioff
Reg 3V R Off Toff C Off 6V 2V
+
Comp1
S R Q
Ref VRef
+ Comp2 -
Blank Pulse
I O
OUT
Gate Driver
Sen RS
Logic
GND
Figure 4. Current Control Circuit
VRef VSen Comp2 OUT
Comp2
VToff Comp1 -IN Comp1 OUT
Valid
Invalid
Valid
OUT
ON
OFF
ON
OFF
A
(A) (B)
Toff
B
Figure 3. Output current control circuit
Figure 5. Current Control Circuit Timing Chart
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LC5200 Series
LED Current Setting and Dimming Output current level can be set using two alternative methods: * Internal PWM Control. The LC5200 series provides fixed offtime PWM current control operation, allowing implementation of an LED constant-current control circuit with only a small quantity of external components. The output current is calculated by the formula below: IO = VREF / RS Based on this formula, there are two methods of LED current control available: Analog control, varying the REF pin voltage as shown in figure 6, panel A) PWM integrated control, inputting external PWM signal through a low pass filter (LPF) and connecting the output to the REF pin (figure 6, panel B) In either method, the TOFF pin voltage is used to turn the
LED Drivers
MOSFET on or off, therefore, the circuit in figure 6, panel C also works to adjust the output current by the external signal. In this application, when the external small signal MOSFET turns on, LC5200 stops an output pulse. * External PWM Control. In this method of control, the LC5200 allows direct on/off control of the MOSFET, for synchronizing PWM operation among LED arrays or for other reasons. With this method, a pull-up shunt is connected from the REF pin to the regulator output as shown figure 7. The capacitor and resistor are removed from the TOFF pin, and instead the PWM signal is input to the TOFF pin. Note that for this method, the internal peak current control is disabled; therefore, it requires an external current control circuit for constant current operation. However, overcurrent protection is still in active to protect the LC5200 and LEDs from excessive current. The TOFF pin threshold has hysteresis characteristics: from < 2 V to MOSFET off, and from > 3 V to MOSFET on. Therefore, use 5 V CMOS compatible input for the control.
REG ROFF R1 TOFF REF COFF R2 LC5200 SENSE RS PWM LPF RLPF CLPF COFF ROFF
REG LC5200 TOFF REF SENSE RS
GND
GND
(A) Analog control
(B) Integrated PWM control
REG ROFF MOSFET PWM 100 Hz (C) External signal on TOFF pin Figure 6. Implementations of internal PWM control REG REF LC5200 COFF R2 R1 LC5200 TOFF REF GND SENSE RS
Internal PWM Truth Table
PWM Low High OUT Low (ON) High (OFF)
PWM
TOFF GND SENSE
External PWM Truth Table
TOFF OUT High (OFF) Low (ON)
RS
Low < 2 V High > 3 V
Figure 7. Implementation of external PWM control
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LC5200 Series
About TRIAC Dimming Control (Phase Control) Commonly used TRIAC dimmers are designed for mainly resistive loads and they require TRIAC holding current for proper phase controls. LC5200 series does not respond to this type of dimmers because it does not have function to create the holding current during phase off period. Power Factor Improvement Making the LED current proportional to the AC input voltage improves the power factor, and it can be realized using LC5200 series REF pin function. Figure 8 shows the application circuit. There is no AC rectification capacitor, and R2 and R3 divide the AC voltage to create a proportional low voltage as the AC voltage
LED Drivers
for the REF pin. This way, LED current follows the AC voltage shape and improves the power factor. In case the REF voltage fluctuates widely, place a clamp diode in parallel with R2 to protect the REF pin. In that case, the REF voltage becomes distorted (lower waveform in figure 8) and could cause the power factor to decrease. Figure 9 shows actual waveforms of the operation. Panel A shows operation with fixed REF pin voltage, and panel B shows operation with AC proportional REF pin voltage. For both operations, there is no AC rectification capacitor used. The yellow waveform is the AC input current, and the black waveform is a 2 kHz low pass filtered waveform. In panel B, the current forms a sine waveform, which means the power factor is improved.
vBB
Optional clamp diode R3
VBB
PF improved
vBB
LC5200
REF GND
vREF
R2
vRef
vRef R2 vBB R2 R3
VF
PF loss with clamping
Figure 8. Power factor improvement circuit
VBB
VBB
IAC after 2 kHz LPF IAC after 2 kHz LPF
ILED ILED
Fixed VREF, PF = 49.1%
AC proportional voltage, PF = 82.9%
Figure 9. Power factor improvement operating waveforms: 100 VAC, 5 white LEDs in series, average LED current 0.5 A; black trace: AC input current IAC after 2 kHz low pass filter = 500 mA/ div.; red trace: IAC after 2 kHz low pass filter = 200 mA/ div.
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LC5200 Series
LED Drivers
Thermal Design
150
100
T
xP D =72 j-a
xP D =60
T[ ]
Tj-c
50
0 0 0.5 1 1.5 2
PD[W]
MOSFET On Voltage versus Drain Current
2
1.5
L
2 C5
05
5 LC
210
VDS[V]
1
0.5
0
0
0.2
0.4
0.6
0.8
1
1.2
ID[A]
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LC5200 Series
LED Drivers
WARNING -- These devices are designed to be operated at lethal voltages and energy levels. Circuit designs that embody these components must conform with applicable safety requirements. Precautions must be taken to prevent accidental contact with power-line potentials. Do not connect grounded test equipment. The use of an isolation transformer is recommended during circuit development and breadboarding.
Because reliability can be affected adversely by improper storage environments and handling methods, please observe the following cautions. Cautions for Storage * Ensure that storage conditions comply with the standard temperature (5C to 35C) and the standard relative humidity (around 40 to 75%); avoid storage locations that experience extreme changes in temperature or humidity. * Avoid locations where dust or harmful gases are present and avoid direct sunlight. * Reinspect for rust on leads and solderability of products that have been stored for a long time. Cautions for Testing and Handling When tests are carried out during inspection testing and other standard test periods, protect the products from power surges from the testing device, shorts between adjacent products, and shorts to the heatsink. Remarks About Using Silicone Grease with a Heatsink * When silicone grease is used in mounting this product on a heatsink, it shall be applied evenly and thinly. If more silicone grease than required is applied, it may produce stress. * Coat the back surface of the product and both surfaces of the insulating plate to improve heat transfer between the product and the heatsink. * Volatile-type silicone greases may permeate the product and produce cracks after long periods of time, resulting in reduced heat radiation effect, and possibly shortening the lifetime of the product. * Our recommended silicone greases for heat radiation purposes, which will not cause any adverse effect on the product life, are indicated below: Type G746 YG6260 SC102 Suppliers Shin-Etsu Chemical Co., Ltd. Momentive Performance Materials Dow Corning Toray Silicone Co., Ltd.
Heatsink Mounting Method
*
Torque When Tightening Mounting Screws. Thermal resistance increases when tightening torque is low, and radiation effects are decreased. When the torque is too high, the screw can strip, the heatsink can be deformed, and distortion can arise in the product frame. To avoid these problems, observe the recommended tightening torques for this product package type, TO-3P (MT-100): 0.686 to 0.882 N*m (7 to 9 kgf*cm). Diameter of Heatsink Hole: < 4 mm. The deflection of the press mold when making the hole may cause the case material to crack at the joint with the heatsink. Please pay special attention for this effect. When soldering the products, please be sure to minimize the working time, within the following limits: 2605C 10 s 3505C 3s
*
Soldering *
*
Soldering iron should be at a distance of at least 1.5 mm from the body of the products When handling the products, operator must be grounded. Grounded wrist straps worn should have at least 1 M of resistance to ground to prevent shock hazard. Workbenches where the products are handled should be grounded and be provided with conductive table and floor mats. When using measuring equipment such as a curve tracer, the equipment should be grounded. When soldering the products, the head of soldering irons or the solder bath must be grounded in other to prevent leak voltages generated by them from being applied to the products. The products should always be stored and transported in our shipping containers or conductive containers, or be wrapped in aluminum foil.
Electrostatic Discharge *
* * *
*
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LC5200 Series
Package Drawing, DIP-7 (DIP-8)
LED Drivers
SK
D
Dimensions in MM Terminal treatment: Ni plating and solder plating (Pb-free)
Marking Position Contents The last digit of the year The Month The Week Sanken Registration Number 0 to 9 1 to 9,O,N,D 1 to 3 alphanumeric characters Indication

Appearance: The body shall be clean and shall not bear any stain, rust or flaw. Marking: The type number and lot number shall be clearly marked by laser so that cannot be erased easily.
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LC5200 Series
Packing Specifications
Minimum type of packing: Stick Capacity:50pcs per stick
LED Drivers
Dimensions in millimeters
Direction of parts insertion
Plugs with tab
Plugs without tab
50 pcs
Packing style
Stick Packing 1 (Inner box) Capacity:50 Sticks per box
Stick Packing 2 (Outer Box) Capacity:4 inner boxes per outer box (Maximum quantity of Products:10,000 pcs.)
Dimensions in millimeters
Dimensions in millimeters
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LC5200 Series
LED Drivers
Application and operation examples described in this document are quoted for the sole purpose of reference for the use of the products herein and neither Sanken nor Allegro can assume any responsibility for any infringement of industrial property rights, intellectual property rights or any other rights of Sanken or any third party which may result from its use. When using the products herein, the applicability and suitability of such products for the intended purpose shall be reviewed at the user's responsibility. Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semiconductor products at a certain rate is inevitable. Users of Sanken products are requested to take, at their own risk, preventative measures including safety design of the equipment or systems against any possible injury, death, fires or damages to the society due to device failure or malfunction. Sanken products listed in this document are designed and intended for the use as components in general purpose electronic equipment or apparatus (home appliances, office equipment, telecommunication equipment, measuring equipment, etc.). When considering the use of Sanken products in the applications where higher reliability is required (transportation equipment and its control systems, traffic signal control systems or equipment, fire/crime alarm systems, various safety devices, etc.), please contact your nearest Sanken or Allegro sales representative to discuss and obtain written confirmation of your spec ifications. The use of Sanken products without the written consent of Sanken in the applications where extremely high reliability is required (aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly prohibited. Anti radioactive ray design is not considered for the products listed herein.
Cautions and Warnings
Terminal connection
To avoid malfunction, terminals of this IC should not be left open.
Operation of the protection circuit
(OCP,TSD) This product has two protection circuits (OCP and TSD). These protection circuits work by detecting excessive applied to the driver. Therefore, these function are not able to protect if the power exceeds the tolerance of the driver.
Handling
When static electricity is a problem, care should be taken to properly control the room humidity, especially in the winter when static electricity is most troublesome.
IC
Care should be taken with device leads and with assembly sequence to avoid applying static charges to IC leads. PC board pins should be shorted together to keep them at the same potential to avoid this kind of trouble.
Cautions for Storage
Ensure that storage conditions comply with the standard temperature (5C to 35C) and the standard relative humidity (approximately 40% to 75%) and avoid storage locations that experience extreme changes in temperature or humidity.
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LC5200 Series
LED Drivers
The products described herein are manufactured in Japan by Sanken Electric Co., Ltd. for sale by Allegro MicroSystems, Inc. Sanken and Allegro reserve the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Therefore, the user is cautioned to verify that the information in this publication is current before placing any order. When using the products described herein, the applicability and suitability of such products for the intended purpose shall be reviewed at the users responsibility. Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semiconductor products at a certain rate is inevitable. Users of Sanken products are requested to take, at their own risk, preventative measures including safety design of the equipment or systems against any possible injury, death, fires or damages to society due to device failure or malfunction. Sanken products listed in this publication are designed and intended for use as components in general-purpose electronic equipment or apparatus (home appliances, office equipment, telecommunication equipment, measuring equipment, etc.). Their use in any application requiring radiation hardness assurance (e.g., aerospace equipment) is not supported. When considering the use of Sanken products in applications where higher reliability is required (transportation equipment and its control systems or equipment, fire- or burglar-alarm systems, various safety devices, etc.), contact a company sales representative to discuss and obtain written confirmation of your specifications. The use of Sanken products without the written consent of Sanken in applications where extremely high reliability is required (aerospace equipment, nuclear power-control stations, life-support systems, etc.) is strictly prohibited. The information included herein is believed to be accurate and reliable. Application and operation examples described in this publication are given for reference only and Sanken and Allegro assume no responsibility for any infringement of industrial property rights, intellectual property rights, or any other rights of Sanken or Allegro or any third party that may result from its use. Anti radioactive ray design is not considered for the products listed herein.
Copyright (c) 2009 Allegro MicroSystems, Inc.
This datasheet is based on Sanken datasheet SSE-23014
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